Chip structure and process for forming the same

ABSTRACT

A chip structure comprises a substrate, a first built-up layer, a passivation layer and a second built-up layer. The substrate includes many electric devices placed on a surface of the substrate. The first built-up layer is located on the substrate. The first built-up layer is provided with a first dielectric body and a first interconnection scheme, wherein the first interconnection scheme interlaces inside the first dielectric body and is electrically connected to the electric devices. The first interconnection scheme is constructed from first metal layers and plugs, wherein the neighboring first metal layers are electrically connected through the plugs. The passivation layer is disposed on the first built-up layer and is provided with openings exposing the first interconnection scheme. The second built-up layer is formed on the passivation layer. The second built-up layer is provided with a second dielectric body and a second interconnection scheme, wherein the second interconnection scheme interlaces inside the second dielectric body and is electrically connected to the first interconnection scheme. The second interconnection scheme is constructed from at least one second metal layer and at least one via metal filler, wherein the second metal layer is electrically connected to the via metal filler. The thickness, width, and cross-sectional area of the traces of the second metal layer are respectively larger than those of the first metal layers.

CROSS-REFERENCE TO RELATED APPLICATION

[0001] The present application is a continuation-in-part of a pendingpatent application Ser. No. 09/216,791, filed Dec. 21, 1998, by M. S.Lin. The present application is a continuation-in-part of a pendingpatent application Ser. No. 09/251,183, filed Feb. 17, 1999, by M. S.Lin. The present application is a continuation-in-part of a pendingpatent application Ser. No. 09/691,497, filed Oct. 18, 2000, by M. S.Lin and J. Y. Lee. The present application is a continuation-in-part ofa pending patent application Ser. No. 09/972,639, filed Oct. 9, 2001, byM. S. Lin. All disclosures of these prior applications are incorporatedherein by reference.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The invention relates in general to a chip structure and aprocess for forming the same. More particularly, the invention relatesto a chip structure for improving the resistance-capacitance delay and aforming process thereof.

[0004] 2. Description of the Related Art

[0005] Nowadays, electronic equipment are increasingly used to achievemany various tasks. With the development of electronics technology,miniaturization, multi-function task, and comfort of utilization areamong the principle guidelines of electronic product manufacturers. Moreparticularly in semiconductor manufacture process, the semiconductorunits with 0.18 microns have been mass-produced. However, the relativelyfine interconnections therein negatively impact the chip. For example,this causes the voltage drop of the buses, the resistance-capacitordelay of the key traces, and noises, etc.

[0006]FIG. 1 is a cross-sectional view showing a conventional chipstructure with interconnections.

[0007] As shown in FIG. 1, a chip structure 100 is provided with asubstrate 110, an built-up layer 120 and a passivation layer 130. Thereare plenty of electric devices 114, such as transistors, on a surface112 of the substrate 110, wherein the substrate 110 is made of, forexample, silicon. The built-up layer 120 provided with a dielectric body122 and an interconnection scheme 124 is formed on the surface 112 ofthe substrate 110. The interconnection scheme 124 interlaces inside thedielectric body 122 and is electrically connected to the electricdevices 114. Further, the interconnection scheme 124 includes manyconductive pads 126 exposed outside the dielectric body 122 and theinterconnection scheme 124 can electrically connect with externalcircuits through the conductive pads 126. The dielectric body 122 ismade of, for instance, silicon nitride or silicon oxide. In addition,the passivation layer 130 is deposited on the built-up layer 120, andhas many openings respectively exposing the conductive pads 126. Theinterconnection scheme 124 includes at least one metal layer that canserve as a power bus or a ground bus. The power bus or the ground bus isconnected to at least one of the conductive pads 126 through which thepower bus or the ground bus can electrically connect with externalcircuits.

[0008] However, as far as the chip structure 100 is concerned,resistance-capacitance (RC) delay is easily generated because the linewidth of the interconnection scheme 124 is extremely fine, about below0.3 microns, the thickness of the interconnection scheme 124 isextremely thin, and the dielectric constant of the dielectric body 122is extremely high, about 4. Therefore, the chip efficiency drops off. Inparticular, the RC delay even usually occurs with respect to a powerbus, a ground bus or other metal lines transmitting common signals. Inaddition, the production of the interconnection scheme 124 withextremely fine line width is necessarily performed using facilities withhigh accuracy. This causes production costs to dramatically rise.

[0009] The present invention is related to a R.O.C. patent applicationSer. No. 88120548, filed Nov. 25, 1999, by M. S. Lin, issued Sep. 1,2001, now R.O.C. Pat. No.140721. R.O.C. patent application Ser. No.88120548 claims the priority of pending U.S. patent application Ser. No.09/251,183 and the subject matter thereof is disclosed in pending U.S.patent application Ser. No. 09/251,183. The present invention is relatedto a R.O.C. patent application Ser. No.90100176, filed Jan. 4, 2001, byM. S. Lin and J. Y. Lee, now pending. The subject matter of R.O.C.patent application Ser. No.90100176 is disclosed in pending U.S. patentapplication Ser. No. 09/691,497. The present invention is related to aJapanese patent application Ser. No.200156759, filed Mar. 1, 2001, by M.S. Lin and J. Y. Lee, now pending. The present invention is related to aEuropean patent application Ser. No.01480077.5, filed Aug. 27, 2001, byM. S. Lin and J. Y. Lee, now pending. The present invention is relatedto a Singaporean patent application Ser. No.200101847-2, filed Mar. 23,2001, by M. S. Lin and J. Y. Lee, now pending. Japanese patentapplication Ser. No.200156759, European patent application Ser.No.01480077.5, and Singaporean patent application Ser. No. 200101847-2claim the priority of pending U.S. patent application Ser. No.09/691,497 and the subject matter of them is disclosed in pending U.S.patent application Ser. No. 09/691,497.

SUMMARY OF THE INVENTION

[0010] Accordingly, an objective of the present invention is to providea chip structure and a process for forming the same that improvesresistance-capacitance delay and reduces energy loss of the chip.

[0011] Another objective of the present invention is to provide a chipstructure and a process for forming the same that can be produced usingfacilities with low accuracy. Therefore, production costs cansubstantially reduce.

[0012] To achieve the foregoing and other objectives, the presentinvention provides a chip structure that comprises a substrate, a firstbuilt-up layer, a passivation layer and a second built-up layer. Thesubstrate includes many electric devices placed on a surface of thesubstrate. The first built-up layer is located on the substrate. Thefirst built-up layer is provided with a first dielectric body and afirst interconnection scheme, wherein the first interconnection schemeinterlaces inside the first dielectric body and is electricallyconnected to the electric devices. The first interconnection scheme isconstructed from first metal layers and plugs, wherein the neighboringfirst metal layers are electrically connected through the plugs. Thepassivation layer is disposed on the first built-up layer and isprovided with openings exposing the first interconnection scheme. Thesecond built-up layer is formed on the passivation layer. The secondbuilt-up layer is provided with a second dielectric body and a secondinterconnection scheme, wherein the second interconnection schemeinterlaces inside the second dielectric body and is electricallyconnected to the first interconnection scheme. The secondinterconnection scheme is constructed from at least one second metallayer and at least one via metal filler, wherein the second metal layeris electrically connected to the via metal filler. The thickness, width,and cross-sectional area of the traces of the second metal layer arerespectively larger than those of the first metal layers. In addition,the first dielectric body is constructed from at least one firstdielectric layer, and the second dielectric body is constructed from atleast one second dielectric layer. The individual second dielectriclayer is thicker than the individual first dielectric layer.

[0013] According to a preferred embodiment of the present invention, thethickness of the traces of the second metal layer ranges from 1 micronto 50 microns; the width of the traces of the second metal layer rangesfrom 1 micron to 1 centimeter; the cross sectional area of the traces ofthe second metal layer ranges from 1 square micron to 0.5 squaremillimeters. The first dielectric body is made of, for example, aninorganic compound, such as a silicon nitride compound or a siliconoxide compound. The second dielectric body is made of, for example, anorganic compound, such as polyimide (PI), benzocyclobutene (BCB), porousdielectric material, or elastomer. In addition, the above chip structurefurther includes at least one electrostatic discharge (ESD) circuit andat least one transitional unit that are electrically connected to thefirst interconnection scheme. The transitional unit can be a driver, areceiver or an I/O circuit. Moreover, the first interconnection schemeinclude at least one first conductive pad, at least one secondconductive pad, and at least one linking trace, wherein the openings ofthe passivation layer expose the first conductive pad and the secondconductive pad. The second conductive pad is electrically connected tothe second interconnection scheme. The first conductive pad is exposedto the outside. The linking trace connects the first conductive pad withthe second conductive pad and is shorter than 5,000 microns.

[0014] To sum up, the chip structure of the present invention candecline the resistance-capacitance delay, the power of the chip, and thetemperature generated by the driving chip since the cross sectionalarea, the width and the thickness of the traces of the second metallayer are extremely large, since the cross sectional area of the viametal filler is also extremely large, since the second interconnectionscheme can be made of low-resistance material, such as copper or gold,since the thickness of the individual second dielectric layer is alsoextremely large, and since the second dielectric body can be made oforganic material, the dielectric constant of which is very low,approximately between 1˜3, the practical value depending on the appliedorganic material.

[0015] In addition, the chip structure of the present invention cansimplify a design of a substrate board due to the node layoutredistribution, fitting the design of the substrate board, of the chipstructure by the second interconnection scheme and, besides, theapplication of the fewer nodes to which ground voltage or power voltageis applied. Moreover, in case the node layout redistribution of variouschips by the second interconnection scheme causes the above variouschips to be provided with the same node layout, the node layout,matching the same node layout of the above various chips, of thesubstrate board can be standardized. Therefore, the cost of fabricatingthe substrate board substantially drops off.

[0016] Moreover, according to the chip structure of the presentinvention, the second interconnection scheme can be produced usingfacilities with low accuracy. Therefore, production costs of the chipstructure can substantially be reduced.

[0017] To achieve the foregoing and other objectives, the presentinvention provides a process for making the above chip structure. Theprocess for fabricating a chip structure comprises the following steps.

[0018] Step 1: A wafer is provided with a passivation layer, and thepassivation layer is disposed on a surface layer of the wafer.

[0019] Step 2: A dielectric sub-layer is formed over the passivationlayer of the wafer, and the dielectric sub-layer has at least oneopening passing through the dielectric sub-layer.

[0020] Step 3: At least one conductive metal is formed onto thedielectric sub-layer and into the opening; and

[0021] Step 4: the conductive metal formed outside the opening isremoved.

[0022] Provided that multiple metal layers are to be formed, thesequential steps 2-4 are repeated at least one time.

[0023] To achieve the foregoing and other objectives, the presentinvention provides another process for making the above chip structure.The process for fabricating a chip structure comprises the followingsteps.

[0024] Step 1: A wafer is provided with a passivation layer, and thepassivation layer is disposed on a surface layer of the wafer.

[0025] Step 2: A first dielectric sub-layer is formed over thepassivation layer of the wafer, and the first dielectric sub-layer hasat least one via metal opening passing through the first dielectricsub-layer.

[0026] Step 3: A first conductive layer is formed onto the firstdielectric sub-layer and into the via metal opening.

[0027] Step 4: At least one first conductive metal is formed onto thefirst conductive layer.

[0028] Step 5: The first conductive layer and the first conductive metalthat are formed outside the via metal opening are removed.

[0029] Step 6: A second dielectric sub-layer is formed onto the firstdielectric sub-layer. The second dielectric sub-layer has at least onemetal-layer opening passing through the second dielectric sub-layer. Themetal-layer opening exposes the first conductive metal formed in the viametal opening.

[0030] Step 7: A second conductive layer is formed onto the seconddielectric sub-layer and into the metal-layer opening.

[0031] Step 8: At least one second conductive metal is formed onto thesecond conductive layer.

[0032] Step 9: The second conductive layer and the second conductivemetal that are formed outside the metal-layer opening are removed.

[0033] Provided that multiple metal layers are to be formed, thesequential steps 2-9 are repeated at least one time.

[0034] To achieve the foregoing and other objectives, the presentinvention provides another process for making the above chip structure.The process for fabricating a chip structure comprises the followingsteps.

[0035] Step 1: A wafer is provided with a passivation layer and thepassivation layer is disposed on a surface layer of the wafer.

[0036] Step 2: A first dielectric sub-layer is formed over thepassivation layer of the wafer. The first dielectric sub-layer has atleast one via metal opening passing through the first dielectricsub-layer.

[0037] Step 3: A second dielectric sub-layer is formed onto the firstdielectric sub-layer and into the via metal opening;

[0038] Step 4: The second dielectric sub-layer deposited in the viametal opening and at least one part of the second dielectric sub-layerdeposited on the first dielectric sub-layer are removed. The removedpart of the second dielectric sub-layer outside the via metal opening isdefined as at least one metal-layer opening. The metal-layer openingconnects with the via metal opening.

[0039] Step 5: A conductive layer is formed onto the second dielectricsub-layer, into the via metal opening and into the metal-layer opening.

[0040] Step 6: At least one conductive metal is formed onto theconductive layer.

[0041] Step 7: The conductive layer and the conductive metal that areformed outside the metal-layer opening are removed.

[0042] Provided that multiple metal layers are to be formed, thesequential steps 2-7 are repeated at least one time.

[0043] To achieve the foregoing and other objectives, the presentinvention provides a process for making a patterned dielectricsub-layer. A process for forming a patterned dielectric sub-layercomprises the following steps.

[0044] Step 1: A dielectric sub-layer that is photosensitive isprovided.

[0045] Step 2: A photolithography process is performed. In themeanwhile, a photo mask is provided with a first region and a secondregion. The energy of the light passing through the first region isstronger than that of the light passing through the second region. Anexposing process and a developing process are used to form at least onevia metal opening passing through the dielectric sub-layer and at leastone metal-layer opening not passing through the dielectric sub-layer.The via metal opening connects with the metal-layer opening. Further,during the exposing process, the first region is aligned with where thevia metal opening is to be formed while the second region is alignedwith where the metal-layer opening is to be formed. The first region ofthe photo mask is like a through-hole type. The first region of thephoto mask is like a type of a semi-transparent membrane.

[0046] To achieve the foregoing and other objectives, the presentinvention provides another process for making a patterned dielectricsub-layer. A process for forming a patterned dielectric sub-layercomprises the following steps.

[0047] Step 1: A first dielectric sub-layer is provided with at leastone first opening passing therethrough.

[0048] Step 2: A second dielectric sub-layer is formed onto the firstdielectric sub-layer and into the first opening.

[0049] Step 3: The second dielectric sub-layer deposited in the viametal opening and at least one part of the second dielectric sub-layerdeposited on the first dielectric sub-layer are removed. The removedpart of the second dielectric sub-layer outside the via metal opening isdefined as at least one metal-layer opening. The metal-layer openingconnects with the via metal opening.

[0050] Provided the first dielectric sub-layer is non-photosensitivematerial and the second dielectric sub-layer is photosensitive material,a photolithography process is used, during Step 3, to remove the seconddielectric sub-layer. In addition, provided a photolithography processand an etching process are used, during Step 3, to remove the seconddielectric sub-layer, the etchant of the second dielectric sub-layerhardly etches the first dielectric sub-layer.

[0051] Both the foregoing general description and the following detaileddescription are exemplary and explanatory only and are not restrictiveof the invention, as claimed. It is to be understood that both theforegoing general description and the following detailed description areexemplary, and are intended to provide further explanation of theinvention as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

[0052] The accompanying drawings are included to provide a furtherunderstanding of the invention, and are incorporated in and constitute apart of this specification. The drawings illustrate embodiments of theinvention and, together with the description, serve to explain theprinciples of the invention. A simple description of the drawings is asfollows.

[0053]FIG. 1 is a cross-sectional view schematically showing aconventional chip structure with interconnections.

[0054]FIG. 2 is a cross-sectional view schematically showing a chipstructure according to a first embodiment of the present invention.

[0055]FIG. 3 is a cross-sectional view schematically showing a chipstructure according to a second embodiment of the present invention.

[0056]FIG. 4 is a cross-sectional view schematically showing a chipstructure according to a third embodiment of the present invention.

[0057]FIG. 5 is a cross-sectional view schematically showing a chipstructure according to a forth embodiment of the present invention.

[0058]FIG. 6 is a cross-sectional view schematically showing a chipstructure according to a fifth embodiment of the present invention.

[0059]FIG. 7 is a cross-sectional view schematically showing a chipstructure according to a sixth embodiment of the present invention.

[0060]FIG. 8 is a cross-sectional view schematically showing a chipstructure according to a seventh embodiment of the present invention.

[0061] FIGS. 9-17 are various cross-sectional views schematicallyshowing a process of fabricating a chip structure according to anembodiment of the present invention.

[0062]FIG. 17A is a cross-sectional view schematically showing a chipstructure according to another embodiment of the present invention.

[0063]FIG. 17B is a cross-sectional view schematically showing a chipstructure according to another embodiment of the present invention.

[0064]FIG. 17C is a cross-sectional view schematically showing a chipstructure according to another embodiment of the present invention.

[0065] FIGS. 18-23 are various cross-sectional views schematicallyshowing a process of fabricating a chip structure according to anotherembodiment of the present invention.

[0066] FIGS. 24-26 are various cross-sectional views schematicallyshowing a process of fabricating a dielectric sub-layer according toanother embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0067] Prior to describing the embodiment of the invention, the factorsof the resistance-capacitance delay and those of the power loss will beintroduced as the following equations.

τ=RC=2ερL [L/(T_(u.d.)T_(m))+L (WS)]

P∝2πfV²kε(tan δ)

[0068] where τ is effect of resistance-capacitance delay; P is powerloss; ε is dielectric constant of dielectric material; ρ is resistanceof traces; L is trace length; W is trace width; S is pitch betweentraces; T_(u.d.) is thickness of dielectric material; Tm is tracethickness; tan δ is dielectric loss; V is applied voltage; f isfrequency; k is factor of capacitor structure.

[0069] According to the above equation, the factors of theresistance-capacitance delay and those of the power loss can be known.Therefore, an increase in thickness of every dielectric layer, anapplication of dielectric material with low dielectric constant, anapplication of traces with low resistance, or an increase in width orthickness of traces leads an effect of a resistance-capacitance delayand a power loss of a chip to decline.

[0070] According to the above conception, the present invention providesvarious improved chip structure. Please refer to FIG. 2, across-sectional view schematically showing a chip structure according toa first embodiment of the present invention. A chip structure 200 isprovided with a substrate 210, a first built-up layer 220, a passivationlayer 230 and a second built-up layer 240. There are plenty of electricdevices 214, such as transistors, on a surface 212 of the substrate 210,wherein the substrate 210 is made of, for example, silicon. The firstbuilt-up layer 220 is located on the substrate 210. The first built-uplayer 220 is formed by cross lamination of first metal multi-layers 226and first dielectric multi-layers. Moreover, plugs 228 connect the upperfirst metal layers 226 with the lower first metal layers 226 or connectthe first metal layers 226 with the electric devices 214. The firstmetal multi-layers 226 and the plugs 228 compose a first interconnectionscheme 222. The first dielectric multi-layers compose a first dielectricbody 224. The first interconnection scheme 222 interlaces inside thefirst dielectric body 224 and is electrically connected to the electricdevices 214. The first interconnection scheme 222 includes plenty ofconductive pads 227 (only shows one of them) that are exposed outsidethe first dielectric body 224. The first interconnection scheme 222 canelectrically connect with other circuits through the conductive pads227. The first dielectric body 224 is made of, for example, an inorganiccompound, such as a silicon oxide compound or a silicon nitridecompound. The material of the first interconnection scheme 222 includes,for example, copper, aluminum or tungsten. Provided that the firstinterconnection scheme 222 is formed by a copper process, the firstmetal layers 226 and the plugs 228 are made of copper. Provided that thefirst interconnection scheme 222 is formed by a general process, thefirst metal layers 226 are made of aluminum and the plugs 228 are madeof tungsten.

[0071] The passivation layer 230 is disposed on the first built-up layer220 and is provided with openings exposing the conductive pads 227. Thepassivation layer 230 is contructed of, for example, an inorganiccompound, such as a silicon oxide compound, a silicon nitride compound,phosphosilicate glass (PSG), a silicon oxide nitride compound or acomposite formed by laminating the above material.

[0072] The second built-up layer 240 is formed on the passivation layer230. The second built-up layer 240 is formed by cross lamination ofsecond metal multi-layers 246 and second dielectric multi-layers 241.Moreover, via metal fillers 248 connect the upper second metal layers246 with the lower second metal layers 246 or connect the second metallayers 246 with the conductive pads 227. The second metal layers 246 andthe via metal fillers 248 compose a second interconnection scheme 242.The second dielectric multi-layers 241 compose a second dielectric body244. The second interconnection scheme 242 interlaces inside the seconddielectric body 244 and is electrically connected to the conductive pads227. The second interconnection scheme 242 includes plenty of nodes 247(only shows one of them). The second dielectric body 244 is providedwith openings 249 exposing the nodes 247 of the second interconnectionscheme 242. The second interconnection scheme 242 can electricallyconnect with external circuits through the nodes 247. The seconddielectric body 244 is made of, for example, an organic compound, suchas polyimide (PI), benzocyclobutene (BCB), porous dielectric material,parylene, elastomer, or other macromolecule polymers. The material ofthe second interconnection scheme 242 includes, for example, copper,aluminum, gold, nickel, titanium-tungsten, titanium or chromium. Becausemobile ions and moisture of the second built-up layer 240 can beprevented by the passivation layer 230 from penetrating into the firstbuilt-up layer 220 or the electric devices 214, it is practicable thatan organic compound and various metals are formed over thepassivationtion layer 230. The cross-sectional area A2 of the traces ofthe second metal layers 246 is extremely larger than the cross-sectionalarea A1 of the traces of the first metal layers 226 and than thecross-sectional area of the plugs 228. The cross-sectional area a of thevia metal fillers 248 is extremely larger than the cross-sectional areaA1 of the traces of the first metal layers 226 and than thecross-sectional area of the plugs 228. The trace width d2 of the secondmetal layers 246 is extremely larger than the trace width d1 of thefirst metal layers 226. The trace thickness t2 of the second metallayers 246 is extremely larger than the trace thickness t1 of the firstmetal layers 226. The thickness L2 of the individual second dielectriclayers 241 is extremely larger than the thickness L1 of the individualfirst dielectric layers of the first built-up layers 220. Thecross-sectional area a of the via metal fillers 248 is extremely largerthan the area, exposed outside the passivation layer 230, of theconductive pads 227. The trace width d2 of the second metal layers 246is larger than 1 micron, and preferably ranges from 1 micron to 1centimeter. The trace thickness t2 of the second metal layers 246 islarger than 1 micron, and preferably ranges from 1 micron to 50 microns.The cross-sectional area A2 of the second metal layers 246 is largerthan 1 square micron, and preferably ranges from 1 square micron to 0.5square millimeters. The cross-sectional area a of the via metal fillers248 is larger than 1 square micron, and preferably ranges from 1 squaremicron to 10,000 square microns. The thickness L2 of the individualsecond dielectric layers 241 is larger than 1 micron, and preferablyranges from 1 micron to 100 microns.

[0073] The above chip structure can decline the resistance-capacitancedelay, the power of the chip, and the temperature generated by thedriving chip since the cross sectional area, the width and the thicknessof the traces of the second metal layers 246 are extremely large, sincethe cross sectional area of the via metal fillers 248 is also extremelylarge, since the second interconnection scheme 242 can be made oflow-resistance material, such as copper or gold, since the thickness L2of the individual second dielectric layers 241 is also extremely large,and since the second dielectric body 244 can be made of organicmaterial, the dielectric constant of which is very low, approximatelybetween 1˜3, the practical value depending on the applied organicmaterial.

[0074] According to the above chip structure, the traces of the secondinterconnection scheme 242 are extremely wide and thick and thecross-sectional area of the via metal fillers 248 is extremely large.Thus, the second interconnection scheme 242 can be formed by low-costfabricating processes, such as an electroplating process, an electrolessplating process, or a sputtering process, and, moreover, the secondinterconnection scheme 242 can be produced using facilities with lowaccuracy. Therefore, the production costs of the chip structure can besubstantially saved. In addition, the request for the clean room wherethe second built-up layer is formed is not high, ranging from Class 10to Class 100. Consequently, the construction cost of the clean room canbe conserved.

[0075] The chip structure can simplify a design of a substrate board dueto the layout redistribution, fitting the design of the substrate board,of the nodes 247 of the chip structure by the second interconnectionscheme 242 and, besides, the application of the fewer nodes 247 to whichground voltage or power voltage is applied. Moreover, in case the layoutredistribution of nodes 247 of various chips by the secondinterconnection scheme 242 causes the above various chips to be providedwith the same node layout, the node layout, matching the same nodelayout of the above various chips, of the substrate board can bestandardized. Therefore, the cost of fabricating the substrate boardsubstantially drops off.

[0076] Next, other preferred embodiments of the present invention willbe introduced. As a lot of electric devices are electrically connectedwith a power bus and a ground bus, the current through the power bus andthe ground bus is relatively large. Therefore, the secondinterconnection scheme of the second built-up layer can be designed as apower bus or a ground bus, as shown in FIG. 3. FIG. 3 is across-sectional view schematically showing a chip structure according toa second embodiment of the present invention. The first interconnectionscheme 322 of the built-up layer 320 electrically connects the secondinterconnection scheme 342 of the built-up layer 340 with the electricdevices 314 and at least one electrostatic discharge circuit 316,wherein the electrostatic discharge circuit 316 is disposed on thesurface 312 of the substrate 310. As a result, provided that the secondinterconnection scheme 342 is designed as a power bus, the secondinterconnection scheme 342 electrically connects with the power ends ofthe electric devices 314. Provided that the second interconnectionscheme 342 is designed as a ground bus, the second interconnectionscheme 342 electrically connects with the ground ends of the electricdevices 314. The second metal layer 346 of the power bus or that of theground bus can be of, for example, a planer type. According to the abovechip structure, each of the power buses or the ground buses canelectrically connect with more electric devices 314 than that of priorart. Consequently, the number of the power buses or the ground buses canbe reduced and, also, the number of the electrostatic discharge circuits316 accompanying the power buses or the ground buses can be reduced. Inaddition, the number of the nodes 347 accompanying the power buses orthe ground buses can be reduced. Thus, the circuit layout can besimplified and the production cost of the chip structure 300 can besaved. The electrostatic discharge circuits 316 can prevent the electricdevices 314 electrically connected with the second interconnectionscheme 344 from being damaged by the sudden discharge of high voltage.In addition, the chip structure 300 can be electrically connected withexternal circuits through the nodes 347 applying a flip-chip type, awire-bonding type or a tape-automated-bonding type.

[0077] Referring to FIG. 4, FIG. 4 is a cross-sectional viewschematically showing a chip structure according to a third embodimentof the present invention. There are many electric devices 414, manyelectrostatic discharge circuits 416 (only shows one of them) and manytransition devices 418 (only shows one of them) on the surface 412 ofthe substrate 410. The first interconnection scheme 422 is divided intofirst interconnections 422 a and first transition interconnections 422b. The second interconnection scheme 442 is divided into secondinterconnections 442 a and second transition interconnections 442 b.Consequently, the nodes 447 are electrically connected with thetransition devices 418 and the electrostatic discharge circuits 416through the first transition interconnections 422 b and the secondtransition interconnections 442 b. The transition devices 418 areelectrically connected with the electric devices 414 through the firstinterconnections 422 a and the second interconnections 442 a. Forexample, this circuit layout can be to transmit clock signals. Theelectrostatic discharge circuits 416 can prevent the electric devices414 and the transition devices 418 from being damaged by the suddendischarge of high voltage. In addition, the chip structure can beelectrically connected with external circuits through the nodes 447applying a flip-chip type, a wire-bonding type or atape-automated-bonding type.

[0078] Referring to FIG. 5, FIG. 5 is a cross-sectional viewschematically showing a chip structure according to a forth embodimentof the present invention. The second metal layer 1546 of the secondinterconnection scheme 1542 is directly formed on the passivation layer1530. Thus, the second metal layer 1546 of the second interconnectionscheme 1542 can be directly electrically connected with the conductivepads 1527, exposed outside the passivation layer 1530, of the firstinterconnection scheme 1522. In addition, the chip structure can beelectrically connected with external circuits through the nodes 1547applying a flip-chip type, a wire-bonding type or atape-automated-bonding type.

[0079] According to the above embodiment, a second built-up layer isconstructed from a second dielectric body and a second interconnectionscheme. However, a second built-up layer also can be composed of only asecond interconnection scheme, as shown in FIG. 6. FIG. 6 is across-sectional view schematically showing a chip structure according toa fifth embodiment of the present invention. The second metal layer 1646of the second interconnection scheme is directly formed on thepassivation layer 1630 and can be directly electrically connected withthe conductive pads 1627, exposed outside the passivation layer 1630, ofthe first interconnection scheme 1622. The second metal layer 1646 isexposed to the outside. In addition, the chip structure can beelectrically connected with external circuits by bonding wires onto thesecond metal layer 1646.

[0080] According to the above chip structure, bumps or wires aredirectly electrically connected with the second interconnection layer.However, the application of the present invention is not limited to theabove embodiment. Bumps or wires also can be directly connected withconductive pads and, besides, through the first interconnection scheme,the bumps or the wires can be electrically connected with the secondinterconnection scheme, as shown in FIG. 7 and FIG. 8. FIG. 7 is across-sectional view schematically showing a chip structure according toa sixth embodiment of the present invention. FIG. 8 is a cross-sectionalview schematically showing a chip structure according to a seventhembodiment of the present invention.

[0081] Referring to FIG. 7, in the chip structure 1700, the conductivepads 1727 aare exposed to the outside and the conductive pads 1727 b aredirectly electrically connected with the second metal layer 1746. Thechip structure 1700 can be electrically connected with external circuitsby bonding wires (not shown) onto the conductive pads 1727 a. Though thefirst transition interconnections 1722 b, the conductive pads 1727 a areelectrically connected with the electrostatic discharge circuits 1716and the transition devices 1718 respectively. Though the firstinterconnections 1722 a, the conductive pads 1727 b and the second metallayer 1746, the transition devices 1718 are electrically connected withthe electric devices 1714. In addition, bumps also can be formed on theconductive pads 1727 a, and the chip structure 1700 can be electricallyconnected with external circuits through the bumps.

[0082] Referring to FIG. 8, in the chip structure 800, the conductivepads 827 aare exposed to the outside and the conductive pads 827 b aredirectly electrically connected with the second interconnection scheme842. Linking traces 829 connect the conductive pads 827 a with theconductive pads 827 b. The chip structure 800 can be electricallyconnected with external circuits by bonding wires (not shown) onto theconductive pads 827 a. Though the linking traces 829 and conductive pads827 b, the conductive pads 827 a are electrically connected with thesecond interconnection scheme 842. Though the first interconnectionscheme 822, the second interconnection scheme 842 is electricallyconnected with the electric devices 814. In addition, bumps (not shown)also can be formed on the conductive pads 827 a, and the chip structure800 can be electrically connected with external circuits through thebumps. The shorter the length S of the linking traces 829, the betterthe electrical efficiency of the chip structure 800. Otherwise, it ispossible that the resistance-capacitance delay and the voltage drop willoccur and the chip efficiency will be reduced. It is preferred that thelength S of the linking traces 829 is less than 5,000 microns.

[0083] Following, the second built-up layer of the present inventionwill be described. FIGS. 9-17 are various cross-sectional viewsschematically showing a process of fabricating a chip structureaccording to an embodiment of the present invention.

[0084] First, referring to FIG. 9, a wafer 502 is provided with asubstrate 510, a first built-up layer 520 and a passivation layer 530.There are plenty of electric devices 514 on a surface 512 of thesubstrate 510. The first built-up layer 520 is formed on the substrate510. The first built-up layer 520 includes a first interconnectionscheme 522 and a first dielectric body 524, wherein the firstinterconnection scheme 522 interlaces inside the first dielectric body524 and is electrically connected to the electric devices 514. The firstdielectric body 524 is constructed from the lamination of firstdielectric multi-layers 521. The first interconnection scheme 522includes first metal multi-layers 526 and plugs 528. Through the plugs528, the first metal layers 526 can be electrically connected with theelectric devices 514 or the first metal layers 526 neighbored. The firstinterconnection scheme 522 further includes one or more conductive pads527 (only shows one of them) that are exposed outside the firstdielectric body 524. The passivation layer 530 is formed on the firstbuilt-up layer 520 and is provided with one or more openings 532exposing the conductive pads 527. The largest width of the openings 532ranges from 0.5 to 200 microns for example. Because the openings 532 canbe formed relatively small, for example, the largest width of theopenings 532 ranging from 0.5 to 20 microns, and, correspondingly, theconductive pads 527 can be formed relatively small, the routing densityof the top metal layer having the conductive pads 527 can be enhanced.Moreover, due to the design of the openings 532 with relatively smalldimensions and high density, correspondingly, the circuits, connectingwith the conductive pads 527, of the second interconnection scheme canbe formed small. As a result, the parasitic capacitance generated by thesecond interconnection scheme can become relatively small.

[0085] Next, a second dielectric sub-layer 541 is formed on thepassivation layer 530 by, for example, a spin-coating process, whereinthe second dielectric sub-layer 541 is made of, for instance,photosensitive organic material. Subsequently, one or more via metalopenings 543 are formed through the second dielectric sub-layer 541using, for example, a photolithography process. The via metal openings543 expose the conductive pads 527. In case that the width of theopenings 532 is very small, the width of the via metal openings 543 canbe designed to be larger than that of the openings 532. This leadsconductive metals, during the following metal-filling process, to beeasily filled into the via metal openings 543 and the openings 532.Also, the second dielectric sub-layer 541 can be made ofnon-photosensitive organic material such that the via metal openings 543are formed using a photolithography and etching process. The sectionalarea of the via metal openings 543 ranges from 1 square micron to 10,000square microns.

[0086] Next, referring to FIG. 10, by, for example, a sputteringprocess, a conductive layer 560 is formed onto the second dielectricsub-layer 541, onto the side walls of the via metal openings 543, andonto the passivation layer 530 and conductive pads 527 exposed by thevia metal openings 543. The conductive layer 560 is made of, forexample, aluminum, titanium-tungsten, titanium or chromium.Subsequently, one or more conductive metals 580 are deposited on theconductive layer 560 by, for example, an electroplating process or asputtering process, as shown in FIG. 11. Then, a chemical-mechanicalpolishing process is preferably used to remove the conductive metals 580and the conductive layer 560 that are located outside the via metalopenings 543 until the second dielectric sub-layer 541 is exposed to theoutside, as shown in FIG. 12.

[0087] Subsequently, as shown in FIG. 13, by, for example, aspin-coating process, another second dielectric sub-layer 570 is formedonto the second dielectric sub-layer 541 previously formed. Then, aphotolithography process or a photolithography and etching process isused to form one or more metal-layer openings 572 through the seconddielectric sub-layer 570, wherein the metal-layer openings 572 exposethe conductive metals 580 formed in the via metal openings 542 and thesecond dielectric sub-layer 541 to the outside. Next, referring to FIG.14, by, for example, a sputtering process, another conductive layer 582is formed onto the second dielectric sub-layer 570, 541, and onto theside walls of the metal-layer openings 572, and onto the conductivemetals 580 formed in the via metal openings 543. Subsequently, one ormore conductive metals 584 are deposited on the conductive layer 582 by,for example, an electroplating process or a sputtering process, as shownin FIG. 15. Then, a chemical-mechanical polishing process is preferablyused to remove the conductive metals 584 and the conductive layer 582that are located outside the metal-layer openings 572 until the seconddielectric sub-layer 570 is exposed to the outside, as shown in FIG. 16.The conductive metals 584 and the conductive layer 582 that are settledin the metal-layer openings 572 are defined as a second metal layer 546.The conductive metals 584 and the conductive layer 582 that are settledin the via metal openings 543 are defined as via metal fillers 548. Thesecond metal layer 546 can be electrically connected with conductivepads 527 through the via metal fillers 548. A wire-bonding process canbe used at this time to form one or more wires electrically connectingthe second metal layer 546 with external circuits.

[0088] Further, the other second dielectric sub-layer 590 can beselectively formed onto the conductive metals 584 and onto the seconddielectric sub-layer 570. The second dielectric sub-layer 590 latestformed can be a photosensitive material. Then, a photolithographyprocess is used to form one or more node openings 592 through the seconddielectric sub-layer 590 wherein the node openings 592 expose theconductive metals 584 to the outside. The conductive metals 584 exposedto the outside are defined as nodes 547. The chip structure 500 can beelectrically connected with external circuits through the nodes 547.Also, in case that the second dielectric sub-layer 590 can be anon-photosensitive material, a photolithography process and a etchingprocess are used to form the node openings 592 through the seconddielectric sub-layer 590. The second built-up layer 540 is completed sofar. The second built-up layer 540 includes a second interconnectionscheme 542 and a second dielectric body 544, wherein the secondinterconnection scheme 542 interlaces inside the second dielectric body544. The second interconnection scheme 542 includes at least one secondmetal layer 546 and at least one via metal filler 548. The via metalfiller 548 is constructed from the conductive metals 580 and theconductive layer 560 that are disposed in the via metal openings 543.The second metal layer 546 is constructed from the conductive metals 580and the conductive layer 560 that are outside the via metal openings 543and on the second dielectric sub-layer 541. The via metal filler 548electrically connects the second metal layers 546 with the conductivepads 527. When the cross-sectional area of the openings 532 is verysmall, the cross-sectional area of the via metal openings 543 can bedesigned to be larger than that of the openings 532. The seconddielectric body 544 is constructed from the lamination of the seconddielectric sub-layers 541, 570, 590. The structure, material, anddimension of the second built-up layer 540 are detailed in the previousembodiments, and the repeat is omitted herein.

[0089] However, the present invention is not limited to the abovefabricating process. Referring to FIG. 17A, FIG. 17A is across-sectional view schematically showing a chip structure according toanother embodiment of the present invention. Before the formation of thesecond dielectric sub-layer 541, a conductive layer 511 and one or moreconductive metals 513 are formed into the openings 532. In the processof forming the conductive layer 511 and the conductive metals 513 intothe openings 532, first, the conductive layer 511 is formed onto thepassivation layer 530, the conductive pads 527 and the side walls of theopenings 532 using a sputtering process. Second, the conductive metals513 are formed onto the conductive layer 511 using a sputtering processor an electroplating process. Third, a chemical-mechanical polishingprocess is preferably used to remove the conductive metals 513 and theconductive layer 511 that are located outside the openings 532 until thepassivation layer 520 is exposed to the outside. So far, the conductivemetals 513 and the conductive layer 511 are exactly formed into theopenings 532. Subsequently, the second dielectric sub-layer 541 isformed on the passivation layer 530 by, for example, a spin-coatingprocess and then one or more via metal openings 543 are formed throughthe second dielectric sub-layer 541 using, for example, aphotolithography process. The via metal openings 543 expose theconductive metals 513 and the conductive layer 511 formed in theopenings 532. Next, by, for example, a sputtering process, a conductivelayer 560 is formed onto the second dielectric sub-layer 541, onto theside walls of the via metal openings 543, onto the passivation layer530, the conductive metals 513 and the conductive layer 511 that areexposed by the via metal openings 543. The following process offabricating the second built-up layer 540 is detailed in the previousembodiment, and the repeat is omitted herein.

[0090] In addition, the chip structure is not limited to the aboveapplication. Referring to FIG. 17B, FIG. 17B is a cross-sectional viewschematically showing a chip structure according to another embodimentof the present invention. A conductive layer 682 and conductive metals684 that are directly formed on the passivation layer 630 can beinterconnection traces 680. The interconnection traces 680 can be formedusing a damascene process stated as the above embodiments. First, thesecond dielectric sub-layer 670 with metal-layer openings 672 in whichinterconnection traces 680 will be formed during the following processesis formed on the passivation layer 630. Next, a conductive layer 682 andconductive metals 684 are sequentially formed into the metal-layeropenings 672 and onto the second dielectric sub-layer 670. Subsequently,the conductive layer 682 and conductive metals 684 outside themetal-layer openings 672 are removed. So far, the formation of theinterconnection traces 680 constructed from the conductive layer 682 andthe conductive metal 684 are completed. Optionally, as shown in FIG.17C, before the second dielectric sub-layer 670 is formed on thepassivation layer 630, a conductive layer 652 and conductive metals 654are formed into the openings 632 of the passivation layer 630 using adamascene process as described in the above embodiment.

[0091] Besides, the chip structure of the present invention can also beperformed by the other process, described as follows. FIGS. 18-23 arevarious cross-sectional views schematically showing a process offabricating a chip structure according to another embodiment of thepresent invention.

[0092] First, referring to FIG. 18, a wafer 702 is provided. Theinternal structure of the wafer 702 is detailed as the previousembodiments, and the repeat is omitted herein. Next, a second dielectricsub-layer 741 is formed onto the passivation layer 730 of the wafer 702by, for example, a spin-coating process, wherein the second dielectricsub-layer 741 is made of, for instance, photosensitive material.

[0093] Subsequently, referring to FIG. 19, a lithography process isperformed. During the lithography process, first, a photo mask 790 isprovided. The photo mask 790 is divided into at least two regions, afirst region 792 and a second region 794, wherein the energy of thelight passing through the first region 792 is stronger than that of thelight passing through the second region 794. Therefore, the first region792 of the photo mask 790 can be designed as a through-hole type. Light,during an exposing process, can pass through the first region 792without energy-loss. The second region 794 of the photo mask 790 can bedesigned as a type of a semi-transparent membrane. Light, during anexposing process, passes through the second region 794 with someenergy-loss. Using the above photo mask 790 and controlling the exposuretime, the second dielectric sub-layer 741 illuminated by light passingthrough the first region 792 can be exposed absolutely therethrough,while the second dielectric sub-layer 741 illuminated by light passingthrough the second region 794 can be partially exposed, i.e. not exposedabsolutely therethrough. Therefore, after the lithography process isperformed, one or more via metal openings 743 and one or moremetal-layer openings 745 are formed in the second dielectric sub-layer741. The via metal openings 743 and the metal-layer openings 745 exposeconductive pads 727 to the outside. The via metal openings 743 areformed by light passing through the first region 792, while themetal-layer openings 745 are formed by light passing through the secondregion 794. In addition, when the cross-sectional area of the openings732 of the passivation layer is very small, the cross-sectional area ofthe via metal openings 743 can be designed to be larger than that of theopenings 732. This leads conductive metals, during the followingmetal-filling process, to be easily filled into the via metal openings743. The cross-sectional area of the via metal fillers 743 preferablyranges from 1 square micron to 10,000 square microns.

[0094] Referring to FIG. 20, by, for example, a sputtering process, aconductive layer 760 is formed onto the second dielectric sub-layer 741,onto the side walls of the via metal openings 743, onto the side wallsof the metal-layer openings 745, and onto the passivation layer 730 andconductive pads 727 exposed by the via metal openings 743. Theconductive layer 760 is made of, for example, aluminum,titanium-tungsten, titanium or chromium.

[0095] Next, one or more conductive metals 780 are deposited on theconductive layer 582 by, for example, an electroplating process or asputtering process, as shown in FIG. 21. The material of the conductivemetals 780 includes copper, nickel, gold or aluminum. Then, achemical-mechanical polishing process is preferably used to remove theconductive metals 780 and the conductive layer 760 that are depositedoutside the metal-layer openings 745 and the via metal openings 743until the second dielectric sub-layer 741 is exposed to the outside, asshown in FIG. 22. The conductive metals 780 and the conductive layer 760that are settled in the metal-layer openings 745 are defined as a secondmetal layer 746. The conductive metals 780 and the conductive layer 760that are settled in the via metal openings 743 are defined as via metalfillers 748. The second metal layer 746 can be electrically connectedwith conductive pads 727 through the via metal fillers 748. Awire-bonding process can be used at this time to form one or more wireselectrically connecting the second metal layer 746 with externalcircuits.

[0096] Further, the other second dielectric sub-layer 770 can beselectively formed onto the conductive metals 780 and onto the seconddielectric sub-layer 741. The second dielectric sub-layer 770 latestformed can be a photosensitive material. Then, a photolithographyprocess is used to form one or more node openings 772 through the seconddielectric sub-layer 770 wherein the node openings 772 expose theconductive metals 780 to the outside. The conductive metals 780 exposedto the outside are defined as nodes 747. The chip structure 700 can beelectrically connected with external circuits through the nodes 747. Thestructure, material, and dimension of the second built-up layer 740 aredetailed in the previous embodiments, and the repeat is omitted herein.

[0097] In the above-mentioned process, via metal openings andmetal-layer openings are formed by only one photolithography process.However, the application of the present invention is not limited to theprevious embodiments. The second dielectric sub-layer can be formedusing other processes, described as follows.

[0098] Referring to FIGS. 24-26, FIGS. 24-26 are various cross-sectionalviews schematically showing a process of fabricating a dielectricsub-layer according to another embodiment of the present invention.First, referring to FIG. 24, a second dielectric sub-layer 941 is formedonto the passivation layer 930 of the wafer 902 and onto conductive pads927 using, for example, a spin-coating process, wherein the seconddielectric sub-layer 941 is non-photosensitive material. Subsequently,via metal openings 943 are formed through the second dielectricsub-layer 941 using, for example, a photolithography process and anetching process, wherein the via metal openings 943 expose conductivepads 927. Next, referring to FIG. 25, another second dielectricsub-layer 970 is formed onto the second dielectric sub-layer 941 using,for example, a spin-coating process. Further, the second dielectricsub-layer 970 is filled into the via metal openings 943. The seconddielectric sub-layer 970 is photosensitive material. Subsequently, usingan exposing process and a developing process, metal-layer openings 972are formed through the second dielectric sub-layer 970 and the seconddielectric sub-layer 970 deposited in the via metal openings 943 isremoved, as shown in FIG. 26. After the via metal openings 943 and themetal-layer opening 972 are formed, the following process, including aprocess of forming a conductive layer, a process of forming conductivemetals, and a process of removing the conductive layer and theconductive metals deposited outside the metal-layer openings, is similarwith the previous embodiment. The repeat is omitted herein.

[0099] In addition, the etching selectivity between the seconddielectric sub-layer 941 and the second dielectric sub-layer 970 isrequested to be high. In other words, the etchant of the seconddielectric sub-layer 970 hardly etches the first dielectric sub-layer941. Therefore, after the second dielectric sub-layer 970 is formed ontothe second dielectric sub-layer 941 and filled into the via metalopenings 943, a photolithography process and an etching process can beused to form metal-layer openings 972 and to remove the seconddielectric sub-layer 970 deposited in the via metal openings 943.

[0100] In addition, according to the above process, the presentinvention is not limited to the application of the second metal layerwith a signal layer. However, second metal multi-layers also can beapplied in the present invention. The fabrication method of the secondmetal multi-layers is to repeat the above fabrication method of thesecond metal layer with a single layer. The second built-up layer, withsecond metal multi-layers, fabricated by the above whatever process isfinally formed with a second dielectric sub-layer having node openingsthat expose the second interconnection scheme to be electricallyconnected with external circuits. Alternatively, the whole surface ofthe second metal layer at the top portion can be exposed to the outside,and through bumps or conducting wires, the second metal layer can beelectrically connected with external circuits. Besides, when the secondmetal layers is over 2 layers, the via metal openings of the seconddielectric sub-layer at a higher portion expose the second metal layerat a lower portion so that the conductive metals disposited in the viametal openings electrically connect the upper second metal layer withthe lower second metal layer.

[0101] According to the above process, the conductive layer or theconductive metal can be simultaneously formed into the openings formedthrough the passivation layer, via metal openings and metal-layeropenings, and the configuration constructed from the conductive layerand the conductive metal is shaped with triple layers. Therefore, theprocess can be called as “triple damascene process”.

[0102] To sum up, the present invention has the following advantages:

[0103] 1. The chip structure of the present invention can decline theresistance-capacitance delay, the power of the chip, and the temperaturegenerated by the driving chip since the cross sectional area, the widthand the thickness of the traces of the second metal layer are extremelylarge, since the cross sectional area of the via metal filler is alsoextremely large, since the second interconnection scheme can be made oflow-resistance material, such as copper or gold, since the thickness ofthe individual second dielectric layer is also extremely large, andsince the second dielectric body can be made of organic material, thedielectric constant of which is very low, approximately between 1˜3, thepractical value depending on the applied organic material.

[0104] 2. According to the chip structure of the present invention, eachof the power buses or the ground buses can electrically connect withmore electric devices than that of prior art. Consequently, the numberof the power buses or the ground buses can be reduced and, also, thenumber of the electrostatic discharge circuits accompanying the powerbuses or the ground buses can be reduced. In addition, the number of thenodes accompanying the power buses or the ground buses can be reduced.Thus, the circuit layout can be simplified and the production cost ofthe chip structure can be saved. The electrostatic discharge circuitscan prevent the electric devices electrically connected with the secondinterconnection scheme from being damaged by the sudden discharge ofhigh voltage.

[0105] 3. The chip structure of the present invention can simplify adesign of a substrate board due to the node layout redistribution,fitting the design of the substrate board, of the chip structure by thesecond interconnection scheme and, besides, the application of the fewernodes to which ground voltage or power voltage is applied. Moreover, incase the node layout redistribution of various chips by the secondinterconnection scheme causes the above various chips to be providedwith the same node layout, the node layout, matching the same nodelayout of the above various chips, of the substrate board can bestandardized. Therefore, the cost of fabricating the substrate boardsubstantially drops off.

[0106] 4. According to the chip structure of the present invention, thesecond interconnection scheme can be produced using facilities with lowaccuracy. Therefore, production costs of the chip structure cansubstantially be reduced.

[0107] It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims and their equivalents.

What is claimed is:
 1. A chip structure, comprising: a substrate havinga plurality of electric devices that are disposed on a surface of thesubstrate; a first built-up layer located on the surface of thesubstrate, and the first built-up layer including a dielectric body anda first interconnection scheme, the first interconnection schemeinterlacing inside the dielectric body of the first built-up layer, andthe first interconnection scheme electrically connected to the electricdevices, the first interconnection scheme including at least one firstconductive pad and at least one second conductive pad, both the firstconductive pad and the second conductive pad located on a surface of thefirst built-up layer, and the first conductive pad exposed to theoutside; and a second built-up layer arranged over the first built-uplayer, the second built-up layer provided with a second interconnectionscheme, the second interconnection scheme electrically connected withthe first interconnection layer through the second conductive pad. 2.The chip structure according to claim 1, wherein the second built-uplayer further includes a dielectric body and the second interconnectionscheme interlaces inside the dielectric body of the second built-uplayer.
 3. The chip structure according to claim 2, wherein thedielectric body of the second built-up layer is made of an organiccompound.
 4. The chip structure according to claim 2, wherein thedielectric body of the second built-up layer is made of a macromoleculepolymer.
 5. The chip structure according to claim 2, wherein thedielectric body of the second built-up layer is made of polyimide (PI),benzocyclobutene (BCB), porous dielectric material, parylene, orelastomer.
 6. The chip structure according to claim 1, wherein at leastone of the electric devices is an electrostatic discharge circuit andthe electrostatic discharge circuit is electrically connected with thefirst interconnection scheme.
 7. The chip structure according to claim1, wherein at least one of the electric devices is a transition device,the transition device is electrically connected with the firstinterconnection scheme, a signal is transmitted from the transitiondevice to the first interconnection scheme and then transmitted to thesecond interconnection scheme, and further, the signal is transmittedfrom the second interconnection scheme to the first interconnectionscheme and finally transmitted to the other one or more of the electricdevices.
 8. The chip structure according to claim 7, wherein thetransition device is a driver, a receiver or an I/O circuit.
 9. The chipstructure according to claim 1, wherein the first interconnection schemefurther includes at least one linking trace, through which the firstconductive pad is electrically connected with the second conductive pad.10. The chip structure according to claim 9, wherein the linking traceis shorter than 5,000 microns.
 11. The chip structure according to claim1, wherein the trace thickness of the second interconnection scheme islarger than that of the first interconnection scheme
 12. The chipstructure according to claim 1, wherein the trace thickness of thesecond interconnection scheme ranges from 1 micron to 50 microns. 13.The chip structure according to claim 1, wherein the trace width of thesecond interconnection scheme is larger than that of the firstinterconnection scheme
 14. The chip structure according to claim 1,wherein the trace width of the second interconnection scheme ranges from1 micron to 1 centimeter.
 15. The chip structure according to claim 1,wherein the cross-sectional area of the traces of the secondinterconnection scheme is larger than that of the traces of the firstinterconnection scheme.
 16. The chip structure according to claim 1,wherein the cross-sectional area of the traces of the secondinterconnection scheme ranges from 1 square micron to 0.5 squaremillimeters.
 17. The chip structure according to claim 1, wherein thesecond interconnection scheme includes at least one metal layer and atleast one via metal filler, the metal layer is electrically connectedwith the via metal filler, and the cross-sectional area of the via metalfiller ranges from 1 square micron to 10,000 square microns.
 18. A chipstructure, comprising: a substrate having a plurality of electricdevices that are disposed on a surface of the substrate; a firstbuilt-up layer located on the surface of the substrate, and the firstbuilt-up layer including a dielectric body and an interconnectionscheme, the interconnection scheme interlacing inside the dielectricbody of the first built-up layer, and the interconnection schemeelectrically connected to the electric devices; a passivation layerdisposed on the first built-up layer and provided with at least oneopening exposing the interconnection scheme; and a second built-up layerarranged over the passivation layer, the second built-up layer providedwith at least one power bus, the power bus electrically connected to theinterconnection layer with passing through the opening of thepassivation layer.
 19. The chip structure according to claim 18, whereinthe trace thickness of the power bus ranges from 1 micron to 50 microns.20. The chip structure according to claim 18, wherein the trace width ofthe power bus ranges from 1 micron to 1 centimeter.
 21. The chipstructure according to claim 18, wherein the cross-sectional area of thetraces of the power bus ranges from 1 square micron to 0.5 squaremillimeters.
 22. The chip structure according to claim 18, wherein thepassivation layer is constructed of an inorganic compound.
 23. The chipstructure according to claim 18, wherein the passivation layer isconstructed of a silicon oxide compound, a silicon nitride compound,phosphosilicate glass (PSG), a silicon oxide nitride compound or acomposite formed by laminating the above material.
 24. The chipstructure according to claim 18, wherein the second built-up layerfurther includes a dielectric body and the power bus interlaces insidethe dielectric body of the second built-up layer.
 25. The chip structureaccording to claim 24, wherein the dielectric body of the secondbuilt-up layer is made of an organic compound.
 26. The chip structureaccording to claim 24, wherein the dielectric body of the secondbuilt-up layer is made of a macromolecule polymer.
 27. The chipstructure according to claim 24, wherein the dielectric body of thesecond built-up layer is made of polyimide (PI), benzocyclobutene (BCB),porous dielectric material, parylene, or elastomer.
 28. The chipstructure according to claim 24, wherein the dielectric body of thesecond built-up layer is composed of at least one dielectric layer, andthe thickness of the dielectric layer ranges from 1 micron to 100microns.
 29. The chip structure according to claim 24, wherein thedielectric body of the first built-up layer is composed of at least onefirst dielectric layer, the dielectric body of the second built-up layeris composed of at least one second dielectric layer, and the seconddielectric layer is thicker than the first dielectric layer.
 30. Thechip structure according to claim 24, wherein the power bus includes atleast one metal layer and at least one via metal filler, the metal layeris electrically connected with the via metal filler, and thecross-sectional area of the via metal filler ranges from 1 square micronto 10,000 square microns.
 31. The chip structure according to claim 18,wherein the power bus includes at least one metal layer and at least onevia metal filler, the metal layer is electrically connected with the viametal filler, and the cross-sectional area of the via metal filler islarger than that of the opening of the passivation layer.
 32. The chipstructure according to claim 18, wherein the power bus is of a planartype.
 33. The chip structure according to claim 18, wherein at least oneof the electric devices is an electrostatic discharge circuit, and theelectrostatic discharge circuit is electrically connected with theinterconnection scheme.
 34. The chip structure according to claim 18,wherein the interconnection scheme includes at least one firstconductive pad and at least one second conductive pad, the openings ofthe passivation layer expose the first conductive pad and the secondconductive pad, the second conductive pad is electrically connected withthe power bus, and the first conductive pad is exposed to the outside.35. The chip structure according to claim 34, wherein theinterconnection scheme further includes at least one linking trace,through which the first conductive pad is electrically connected withthe second conductive pad.
 36. The chip structure according to claim 35,wherein the linking trace is shorter than 5,000 microns.
 37. The chipstructure according to claim 18, wherein the trace thickness of thepower bus is larger than that of the interconnection scheme.
 38. Thechip structure according to claim 18, wherein the trace width of thepower bus is larger than that of the interconnection scheme.
 39. Thechip structure according to claim 18, wherein the cross-sectional areaof the traces of the power bus is larger than that of the traces of theinterconnection scheme.
 40. The chip structure according to claim 18,wherein the largest width of the opening of the passivation layer rangesfrom 0.5 microns to 200 microns.
 41. A chip structure, comprising: asubstrate having a plurality of electric devices that are disposed on asurface of the substrate; a first built-up layer located on the surfaceof the substrate, and the first built-up layer including a dielectricbody and an interconnection scheme, the interconnection schemeinterlacing inside the dielectric body of the first built-up layer, andthe interconnection scheme electrically connected to the electricdevices; a passivation layer disposed on the first built-up layer andprovided with at least one opening exposing the interconnection scheme;and a second built-up layer arranged over the passivation layer, thesecond built-up layer provided with at least one ground bus, the groundbus electrically connected to the interconnection layer with passingthrough the opening of the passivation layer.
 42. The chip structureaccording to claim 41, wherein the trace thickness of the ground busranges from 1 micron to 50 microns.
 43. The chip structure according toclaim 41, wherein the trace width of the ground bus ranges from 1 micronto 1 centimeter.
 44. The chip structure according to claim 41, whereinthe cross-sectional area of the traces of the ground bus ranges from 1square micron to 0.5 square millimeters.
 45. The chip structureaccording to claim 41, wherein the passivation layer is constructed ofan inorganic compound.
 46. The chip structure according to claim 41,wherein the passivation layer is constructed of a silicon oxidecompound, a silicon nitride compound, phosphosilicate glass (PSG), asilicon oxide nitride compound or a composite formed by laminating theabove material.
 47. The chip structure according to claim 41, whereinthe second built-up layer further includes a dielectric body and theground bus interlaces inside the dielectric body of the second built-uplayer.
 48. The chip structure according to claim 47, wherein thedielectric body of the second built-up layer is made of an organiccompound.
 49. The chip structure according to claim 47, wherein thedielectric body of the second built-up layer is made of a macromoleculepolymer.
 50. The chip structure according to claim 47, wherein thedielectric body of the second built-up layer is made of polyimide (PI),benzocyclobutene (BCB), porous dielectric material, parylene, orelastomer.
 51. The chip structure according to claim 47, wherein thedielectric body of the second built-up layer is composed of at least onedielectric layer, and the thickness of the dielectric layer ranges from1 micron to 100 microns.
 52. The chip structure according to claim 47,wherein the dielectric body of the first built-up layer is composed ofat least one first dielectric layer, the dielectric body of the secondbuilt-up layer is composed of at least one second dielectric layer, andthe second dielectric layer is thicker than the first dielectric layer.53. The chip structure according to claim 41, wherein the ground busincludes at least one metal layer and at least one via metal filler, themetal layer is electrically connected with the via metal filler, and thecross-sectional area of the via metal filler ranges from 1 square micronto 10,000 square microns.
 54. The chip structure according to claim 41,wherein the ground bus includes at least one metal layer and at leastone via metal filler, the metal layer is electrically connected with thevia metal filler, and the cross-sectional area of the via metal filleris larger than that of the opening of the passivation layer.
 55. Thechip structure according to claim 41, wherein the ground bus is of aplanar type.
 56. The chip structure according to claim 41, wherein atleast one of the electric devices is an electrostatic discharge circuit,and the electrostatic discharge circuit is electrically connected withthe interconnection scheme.
 57. The chip structure according to claim41, wherein the interconnection scheme includes at least one firstconductive pad and at least one second conductive pad, the openings ofthe passivation layer expose the first conductive pad and the secondconductive pad, the second conductive pad is electrically connected withthe ground bus, and the first conductive pad is exposed to the outside.58. The chip structure according to claim 57, wherein theinterconnection scheme further includes at least one linking trace,through which the first conductive pad is electrically connected withthe second conductive pad.
 59. The chip structure according to claim 58,wherein the linking trace is shorter than 5,000 microns.
 60. The chipstructure according to claim 41, wherein the trace thickness of theground bus is larger than that of the interconnection scheme.
 61. Thechip structure according to claim 41, wherein the trace width of theground bus is larger than that of the interconnection scheme.
 62. Thechip structure according to claim 41, wherein the cross-sectional areaof the traces of the ground bus is larger than that of the traces of theinterconnection scheme.
 63. The chip structure according to claim 41,wherein the largest width of the opening of the passivation layer rangesfrom 0.5 microns to 200 microns.
 64. A chip structure, comprising: asubstrate having a plurality of electric devices that are disposed on asurface of the substrate; a first built-up layer located on the surfaceof the substrate, and the first built-up layer including a dielectricbody and a first interconnection scheme, wherein the firstinterconnection scheme interlaces inside the dielectric body of thefirst built-up layer and is electrically connected to the electricdevices; a passivation layer disposed on the first built-up layer andprovided with at least one opening exposing the first interconnectionscheme; and a second built-up layer arranged over the passivation layer,the second built-up layer provided with a second interconnection scheme,the second interconnection scheme electrically connected to the firstinterconnection layer with passing through the opening of thepassivation layer, wherein a signal is transmitted from one of theelectric devices to the first interconnection scheme, then passesthrough the passivation layer, and finally is transmitted to the secondinterconnection scheme, and further, the signal is transmitted from thesecond interconnection scheme to the first interconnection scheme withpassing through the passivation layer, and finally is transmitted to theother one or more of the electric devices.
 65. The chip structureaccording to claim 64, wherein the passivation layer is constructed ofan inorganic compound.
 66. The chip structure according to claim 64,wherein the passivation layer is constructed of a silicon oxidecompound, a silicon nitride compound, phosphosilicate glass (PSG), asilicon oxide nitride compound or a composite formed by laminating theabove material.
 67. The chip structure according to claim 64, whereinthe second built-up layer further includes a dielectric body and thesecond interconnection scheme interlaces inside the dielectric body ofthe second built-up layer.
 68. The chip structure according to claim 67,wherein the dielectric body of the second built-up layer is made of anorganic compound.
 69. The chip structure according to claim 67, whereinthe dielectric body of the second built-up layer is made of amacromolecule polymer.
 70. The chip structure according to claim 67,wherein the dielectric body of the second built-up layer is made ofpolyimide (PI), benzocyclobutene (BCB), porous dielectric material,parylene, or elastomer.
 71. The chip structure according to claim 64,wherein at least one of the electric devices is a transition device, thetransition device is electrically connected with the firstinterconnection scheme, a signal is transmitted from the transitiondevice to the first interconnection scheme, then passes through thepassivation layer, and finally is transmitted to the secondinterconnection scheme, and further, the signal is transmitted from thesecond interconnection scheme to the first interconnection scheme withpassing through the passivation layer, and finally is transmitted to theother one or more of the electric devices.
 72. The chip structureaccording to claim 71, wherein the transition device is a driver, areceiver or an I/O circuit.
 73. The chip structure according to claim64, wherein the first interconnection scheme includes at least one firstconductive pad and at least one second conductive pad, the openings ofthe passivation layer expose the first conductive pad and the secondconductive pad, the second conductive pad is electrically connected withthe second interconnection scheme, and the first conductive pad isexposed to the outside.
 74. The chip structure according to claim 73,wherein the first interconnection scheme further includes at least onelinking trace, through which the first conductive pad is electricallyconnected with the second conductive pad.
 75. The chip structureaccording to claim 74, wherein the linking trace is shorter than 5,000microns.
 76. A chip, comprising an interconnection scheme and apassivation layer, the interconnection scheme arranged inside the chip,the passivation layer disposed on a surface layer of the chip, thepassivation layer having at least one opening exposing theinterconnection scheme, and the largest width of the opening of thepassivation layer ranging from 0.5 microns to 20 microns.
 77. A chipstructure, comprising: a chip having a first interconnection scheme anda passivation layer, the first interconnection scheme arranged insidethe chip, the passivation layer disposed on a surface layer of the chip,the passivation layer having at least one opening exposing the firstinterconnection scheme, and the largest width of the opening of thepassivation layer ranging from 0.5 microns to 20 microns; and anbuilt-up layer disposed on the passivation layer of the chip, thebuilt-up layer having a second interconnection scheme, and the secondinterconnection scheme electrically connected to the firstinterconnection scheme with passing through the opening of thepassivation layer.
 78. The chip structure according to claim 77, whereinthe trace thickness of the second interconnection scheme ranges from 1micron to 50 microns.
 79. The chip structure according to claim 77,wherein the trace width of the second interconnection scheme ranges from1 micron to 1 centimeter.
 80. The chip structure according to claim 77,wherein the cross-sectional area of the traces of the secondinterconnection scheme ranges from 1 square micron to 0.5 squaremillimeters.
 81. The chip structure according to claim 77, wherein thepassivation layer is constructed of an inorganic compound.
 82. The chipstructure according to claim 77, wherein the passivation layer isconstructed of a silicon oxide compound, a silicon nitride compound,phosphosilicate glass (PSG), a silicon oxide nitride compound or acomposite formed by laminating the above material.
 83. The chipstructure according to claim 77, wherein the built-up layer furtherincludes a dielectric body and the second interconnection schemeinterlaces inside the dielectric body of the built-up layer.
 84. Thechip structure according to claim 83, wherein the dielectric body of thebuilt-up layer is made of an organic compound.
 85. The chip structureaccording to claim 83, wherein the dielectric body of the built-up layeris made of a macromolecule polymer.
 86. The chip structure according toclaim 83, wherein the dielectric body of the built-up layer is made ofpolyimide (PI), benzocyclobutene (BCB), porous dielectric material,parylene, or elastomer.
 87. The chip structure according to claim 83,wherein the dielectric body of the built-up layer is composed of atleast one dielectric layer, and the thickness of the dielectric layerranges from 1 micron to 100 microns.
 88. The chip structure according toclaim 77, wherein the ground bus includes at least one metal layer andat least one via metal filler, the metal layer is electrically connectedwith the via metal filler, the via metal filler is electricallyconnected with the first dielectric layer with passing through theopening of the passivation layer, and the cross-sectional area of thevia metal filler is larger than that of the opening of the passivationlayer.
 89. The chip structure according to claim 77, wherein the secondinterconnection scheme includes at least one metal layer and at leastone via metal filler, the metal layer is electrically connected with thevia metal filler, and the cross-sectional area of the via metal fillerranges from 1 square micron to 10,000 square microns.
 90. A chipstructure, comprising: a substrate having a plurality of electricdevices that are disposed on a surface of the substrate; a firstbuilt-up layer located on the surface of the substrate, and the firstbuilt-up layer including a dielectric body and a first interconnectionscheme, the first interconnection scheme interlacing inside thedielectric body of the first built-up layer, and the firstinterconnection scheme electrically connected to the electric devices,the first interconnection scheme including at least one first conductivepad and at least one second conductive pad, and both the firstconductive pad and the second conductive pad located on a surface of thefirst built-up layer; a passivation layer disposed on the first built-uplayer and provided with at least one opening exposing the firstconductive pad and the second conductive pad, and the first conductivepad exposed to the outside; and a second built-up layer deposited on thepassivation layer, the second built-up layer provided with a secondinterconnection scheme, the second interconnection scheme electricallyconnected with the first interconnection layer through the secondconductive pad.
 91. The chip structure according to claim 90, whereinthe second built-up layer further includes a dielectric body and thesecond interconnection scheme interlaces inside the dielectric body ofthe second built-up layer.
 92. The chip structure according to claim 91,wherein the dielectric body of the second built-up layer is made of anorganic compound.
 93. The chip structure according to claim 91, whereinthe dielectric body of the second built-up layer is made of amacromolecule polymer.
 94. The chip structure according to claim 91,wherein the dielectric body of the second built-up layer is made ofpolyimide (PI), benzocyclobutene (BCB), porous dielectric material,parylene, or elastomer.
 95. The chip structure according to claim 90,wherein at least one of the electric devices is an electrostaticdischarge circuit and the electrostatic discharge circuit iselectrically connected with the first interconnection scheme.
 96. Thechip structure according to claim 90, wherein at least one of theelectric devices is a transition device, the transition device iselectrically connected with the first interconnection scheme, a signalis transmitted from the transition device to the first interconnectionscheme and then transmitted to the second interconnection scheme, andfurther, the signal is transmitted from the second interconnectionscheme to the first interconnection scheme and finally transmitted tothe other one or more of the electric devices.
 97. The chip structureaccording to claim 96, wherein the transition device is a driver, areceiver or an I/O circuit.
 98. The chip structure according to claim90, wherein the first interconnection scheme further includes at leastone linking trace, through which the first conductive pad iselectrically connected with the second conductive pad.
 99. The chipstructure according to claim 98, wherein the linking trace is shorterthan 5,000 microns.
 100. The chip structure according to claim 90,wherein the trace thickness of the second interconnection scheme islarger than that of the first interconnection scheme
 101. The chipstructure according to claim 90, wherein the trace thickness of thesecond interconnection scheme ranges from 1 micron to 50 microns. 102.The chip structure according to claim 90, wherein the trace width of thesecond interconnection scheme is larger than that of the firstinterconnection scheme
 103. The chip structure according to claim 90,wherein the trace width of the second interconnection scheme ranges from1 micron to 1 centimeter.
 104. The chip structure according to claim 90,wherein the cross-sectional area of the traces of the secondinterconnection scheme is larger than that of the traces of the firstinterconnection scheme.
 105. The chip structure according to claim 90,wherein the cross-sectional area of the traces of the secondinterconnection scheme ranges from 1 square micron to 0.5 squaremillimeters.
 106. The chip structure according to claim 90, wherein thesecond interconnection scheme includes at least one metal layer and atleast one via metal filler, the metal layer is electrically connectedwith the via metal filler, and the cross-sectional area of the via metalfiller ranges from 1 square micron to 10,000 square microns.
 107. Thechip structure according to claim 90, wherein the largest width of theopening of the passivation layer ranges from 0.5 microns to 200 microns.108. The chip structure according to claim 90, wherein the passivationlayer is constructed of a silicon oxide compound, a silicon nitridecompound, phosphosilicate glass (PSG), a silicon oxide nitride compoundor a composite formed by laminating the above material.
 109. The processfor fabricating a chip structure, comprising: Step 1: providing a waferwith a passivation layer, the passivation layer disposed on a surfacelayer of the wafer; Step 2: forming a dielectric sub-layer over thepassivation layer of the wafer, the dielectric sub-layer having at leastone opening passing through the dielectric sub-layer; Step 3: forming atleast one conductive metal over the dielectric sub-layer and into theopening; and Step 4: removing the conductive metal formed outside theopening.
 110. The process according to claim 109, wherein before Step 3is performed, a conductive layer is formed on the dielectric sub-layer,and when Step 3 is performed, the conductive metal is formed on theconductive layer.
 111. The process according to claim 109, wherein whenStep 2 is performed, a photo mask including a first region and a secondregion is used, the energy of the light passing through the first regionstronger than that of the light passing through the second region, anexposing process and a developing process used to form at least one viametal opening passing through the dielectric sub-layer and at least onemetal-layer opening not passing through the dielectric sub-layer, thevia metal opening connecting with the metal-layer opening, further,during the exposing process, the first region aligned with where the viametal opening is to be formed, and the second region aligned with wherethe metal-layer opening is to be formed.
 112. The process according toclaim 111, wherein the first region of the photo mask is like athrough-hole type.
 113. The process according to claim 111, wherein thefirst region of the photo mask is like a type of a semi-transparentmembrane.
 114. The process according to claim 109, wherein after Step 4,another dielectric sub-layer is formed over the passivation layer, andthe another dielectric sub-layer covers the conductive metal.
 115. Theprocess according to claim 114, wherein after the another dielectricsub-layer is formed over the passivation layer, at least one nodeopening is formed through the another dielectric sub-layer and exposesthe conductive metal.
 116. The process according to claim 109, whereinthe sequential steps 2-4 are repeated at least one time.
 117. Theprocess according to claim 116, wherein after Step 2 is performed eachtime, the opening of the dielectric sub-layer exposes the conductivemetal formed over the passivation layer.
 118. The process according toclaim 116, wherein after the sequential steps 2-4 are repeated at leastone time, another dielectric sub-layer is formed over the passivationlayer, and the another dielectric sub-layer covers the top conductivemetal.
 119. The process according to claim 118, wherein after theanother dielectric sub-layer is formed over the passivation layer, atleast one node opening is formed through the another dielectricsub-layer and exposes the conductive metal.
 120. The process accordingto claim 109, wherein the wafer having an interconnection scheme, theinterconnection scheme arranged inside the wafer, the passivation layerhaving at least one opening exposing the interconnection scheme,further, during Step 2, the opening of the dielectric sub-layer exposesthe opening of the passivation layer and the interconnection schemeexposed by the opening of the passivation layer.
 121. The processaccording to claim 109, wherein during Step 3, a sputtering process oran electroplating process is used to form the conductive metal over thedielectric sub-layer and into the opening.
 122. The process according toclaim 109, wherein the material of the conductive metal includestitanium-tungsten alloy, titanium, chromium or aluminum, copper, nickel,or gold.
 123. The process according to claim 109, wherein during Step 4,a chemical-mechanical polishing process is used to remove the conductivemetal formed outside the opening.
 124. The process according to claim109, wherein the wafer having an interconnection scheme, theinterconnection scheme arranged inside the wafer, the passivation layerhaving at least one opening exposing the interconnection scheme,further, before Step 2, the process further comprises: forming aconductive layer on the passivation layer and the opening; and removingthe conductive layer outside the opening.
 125. The process forfabricating a chip structure, comprising: Step 1: providing a wafer witha passivation layer, the passivation layer disposed on a surface layerof the wafer; Step 2: forming a first dielectric sub-layer over thepassivation layer of the wafer, the first dielectric sub-layer having atleast one via metal opening passing through the first dielectricsub-layer; Step 3: forming a first conductive layer onto the firstdielectric sub-layer and into the via metal opening; Step 4: forming atleast one first conductive metal over the first conductive layer; Step5: removing the first conductive layer and the first conductive metalthat are formed outside the via metal opening. Step 6: forming a seconddielectric sub-layer onto the first dielectric sub-layer, the seconddielectric sub-layer having at least one metal-layer opening passingthrough the second dielectric sub-layer, the metal-layer openingexposing the first conductive metal formed in the via metal opening;Step 7: forming a second conductive layer onto the second dielectricsub-layer and into the metal-layer opening; Step 8: forming at least onesecond conductive metal over the second conductive layer; and Step 9:removing the second conductive layer and the second conductive metalthat are formed outside the metal-layer opening.
 126. The processaccording to claim 125, wherein after Step 9, a third dielectricsub-layer is formed over the passivation layer, and the third dielectricsub-layer covers the second conductive metal.
 127. The process accordingto claim 126, wherein after the third dielectric sub-layer is formedover the passivation layer, at least one node opening is formed throughthe third dielectric sub-layer and exposes the second conductive metal.128. The process according to claim 125, wherein the sequential steps2-9 are repeated at least one time.
 129. The process according to claim128, wherein after Step 2 is performed each time, the via metal openingexposes the second conductive metal formed over the passivation layer.130. The process according to claim 128, wherein after the sequentialsteps 2-9 are repeated at least one time, a third dielectric sub-layeris formed over the passivation layer, and the third dielectric sub-layercovers the top second conductive metal.
 131. The process according toclaim 130, wherein after the third dielectric sub-layer is formed overthe passivation layer, at least one node opening is formed through thethird dielectric sub-layer and exposes the top second conductive metal.132. The process according to claim 125, wherein the wafer having aninterconnection scheme, the interconnection scheme arranged inside thewafer, the passivation layer having at least one opening exposing theinterconnection scheme, further, during Step 2, the via metal openingexposing the opening of the passivation layer and the interconnectionscheme exposed by the opening of the passivation layer.
 133. The processaccording to claim 125, wherein during Step 3, a sputtering process isused to form the first conductive layer onto the first dielectricsub-layer and into the via metal opening.
 134. The process according toclaim 125, wherein during Step 4, a sputtering process or anelectroplating process is used to form the first conductive metal overthe first conductive layer.
 135. The process according to claim 125,wherein during Step 5, a chemical-mechanical polishing process is usedto remove the first conductive metal and the first conductive layer thatare formed outside the via metal opening.
 136. The process according toclaim 125, wherein during Step 7, a sputtering process is used to formthe second conductive layer onto the second dielectric sub-layer andinto the metal-layer opening.
 137. The process according to claim 125,wherein during Step 8, a sputtering process or an electroplating processis used to form the second conductive metal over the second conductivelayer.
 138. The process according to claim 125, wherein during Step 9, achemical-mechanical polishing process is used to remove the secondconductive metal and the second conductive layer that are formed outsidethe metal-layer opening.
 139. The process according to claim 125,wherein the material of the first conductive layer includestitanium-tungsten alloy, titanium or chromium or aluminum.
 140. Theprocess according to claim 125, wherein the material of the firstconductive metal includes aluminum, copper, nickel, or gold.
 141. Theprocess according to claim 125, wherein the material of the secondconductive layer includes titanium-tungsten alloy, titanium or chromiumor aluminum.
 142. The process according to claim 125, wherein thematerial of the second conductive metal includes aluminum, copper,nickel, or gold.
 143. The process according to claim 125, wherein thewafer having an interconnection scheme, the interconnection schemearranged inside the wafer, the passivation layer having at least oneopening exposing the interconnection scheme, further, before Step 2, theprocess further comprises: forming a conductive layer on the passivationlayer and the opening; and removing the conductive layer outside theopening.
 144. The process for fabricating a chip structure, comprising:Step 1: providing a wafer with a passivation layer, the passivationlayer disposed on a surface layer of the wafer; Step 2: forming a firstdielectric sub-layer over the passivation layer of the wafer, the firstdielectric sub-layer having at least one via metal opening passingthrough the first dielectric sub-layer; Step 3: forming a seconddielectric sub-layer onto the first dielectric sub-layer and into thevia metal opening; Step 4: removing the second dielectric sub-layerdeposited in the via metal opening and at least one part of the seconddielectric sub-layer deposited on the first dielectric sub-layer, theremoved part of the second dielectric sub-layer outside the via metalopening defining at least one metal-layer opening, the metal-layeropening connecting with the via metal opening; Step 5: forming aconductive layer onto the second dielectric sub-layer, into the viametal opening and into the metal-layer opening; Step 6: forming at leastone conductive metal over the conductive layer; and Step 7: removing theconductive layer and the conductive metal that are formed outside themetal-layer opening.
 145. The process according to claim 144, whereinafter Step 7, a third dielectric sub-layer is formed over thepassivation layer, and the third dielectric sub-layer covers theconductive metal.
 146. The process according to claim 145, wherein afterthe third dielectric sub-layer is formed over the passivation layer, atleast one node opening is formed through the third dielectric sub-layerand exposes the conductive metal.
 147. The process according to claim144, wherein the sequential steps 2-7 are repeated at least one time.148. The process according to claim 147, wherein after Step 2 isperformed each time, the via metal opening exposes the conductive metalformed over the passivation layer.
 149. The process according to claim144, wherein after the sequential steps 2-7 are repeated at least onetime, a third dielectric sub-layer is formed over the passivation layer,and the third dielectric sub-layer covers the top conductive metal. 150.The process according to claim 149, wherein after the third dielectricsub-layer is formed over the passivation layer, at least one nodeopening is formed through the third dielectric sub-layer and exposes thetop conductive metal.
 151. The process according to claim 144, whereinthe wafer having an interconnection scheme, the interconnection schemearranged inside the wafer, the passivation layer having at least oneopening exposing the interconnection scheme, further, during Step 2, thevia metal opening exposing the opening of the passivation layer and theinterconnection scheme exposed by the opening of the passivation layer.152. The process according to claim 144, wherein provided the firstdielectric sub-layer is non-photosensitive material and the seconddielectric sub-layer is photosensitive material, a photolithographyprocess is used, during Step 4, to remove the second dielectricsub-layer.
 153. The process according to claim 144, wherein provided aphotolithography process and an etching process are used, during Step 4,to remove the second dielectric sub-layer, the etchant of the seconddielectric sub-layer hardly etches the first dielectric sub-layer. 154.The process according to claim 144, wherein during Step 5, a sputteringprocess is used to form the conductive layer onto the second dielectricsub-layer, into the via metal opening and into the metal-layer opening.155. The process according to claim 144, wherein during Step 6, asputtering process or an electroplating process is used to form theconductive metal over the conductive layer.
 156. The process accordingto claim 144, wherein during Step 7, a chemical-mechanical polishingprocess is used to remove the conductive metal and the conductive layerthat are formed outside the metal-layer opening.
 157. The processaccording to claim 144, wherein the material of the conductive layerincludes titanium-tungsten alloy, titanium or chromium or aluminum. 158.The process according to claim 144, wherein the material of theconductive metal includes aluminum, copper, nickel, or gold.
 159. Theprocess according to claim 144, wherein the wafer having aninterconnection scheme, the interconnection scheme arranged inside thewafer, the passivation layer having at least one opening exposing theinterconnection scheme, further, before Step 2, the process furthercomprises: forming a conductive layer on the passivation layer and theopening; and removing the conductive layer outside the opening.
 160. Aprocess for forming a patterned dielectric sub-layer, a dielectric bodyof an built-up layer can be constructed from the at least one patterneddielectric sub-layer, the process for forming a patterned dielectricsub-layer comprising: providing a dielectric sub-layer that isphotosensitive; and performing a photolithography process, in themeanwhile, a photo mask provided with a first region and a secondregion, the energy of the light passing through the first regionstronger than that of the light passing through the second region, anexposing process and a developing process used to form at least one viametal opening passing through the dielectric sub-layer and at least onemetal-layer opening not passing through the dielectric sub-layer, thevia metal opening connecting with the metal-layer opening, further,during the exposing process, the first region aligned with where the viametal opening is to be formed, and the second region aligned with wherethe metal-layer opening is to be formed.
 161. The process according toclaim 160, wherein the first region of the photo mask is like athrough-hole type.
 162. The process according to claim 160, wherein thefirst region of the photo mask is like a type of a semi-transparentmembrane.
 163. A process for forming patterned dielectric sub-layers, adielectric body of an built-up layer can be constructed from thepatterned dielectric sub-layers, the process for forming patterneddielectric sub-layers comprising: Step 1: providing a first dielectricsub-layer with at least one first opening passing therethrough; Step 2:forming a second dielectric sub-layer onto the first dielectricsub-layer and into the first opening; and Step 3: removing the seconddielectric sub-layer deposited in the via metal opening and at least onepart of the second dielectric sub-layer deposited on the firstdielectric sub-layer, the removed part of the second dielectricsub-layer outside the via metal opening defining at least onemetal-layer opening, the metal-layer opening connecting with the viametal opening.
 164. The process according to claim 163, wherein providedthe first dielectric sub-layer is non-photosensitive material and thesecond dielectric sub-layer is photosensitive material, aphotolithography process is used, during Step 3, to remove the seconddielectric sub-layer.
 165. The process according to claim 163, whereinprovided a photolithography process and an etching process are used,during Step 3, to remove the second dielectric sub-layer, the etchant ofthe second dielectric sub-layer hardly etches the first dielectricsub-layer.